MediaTek has unveiled the Dimensity 9200, its latest flagship chipset and the first with ARM’s Cortex-X3 GPU. Based on the TSMC N4P node, the Dimensity 9200 promises to deliver better performance than the Dimensity 9000 with significantly reduced power consumption, among other advantages.
MediaTek has lifted the lid on the Dimensity 9200, the company’s latest 5G chipset. Billed as being designed to power ‘the next era of flagship smartphones, the Dimensity 9200 is the world’s first smartphone SoC equipped with an ARM Cortex X3 CPU core. Similarly, the Dimensity 9200 debuts ARM’s Immortalis-G715, a GPU that supports hardware-based ray tracing, as well as Wi-Fi 7 Ready connectivity.
Additionally, MediaTek claims numerous other firsts for the Dimensity 9200 too, such as LPDDR5X RAM running at 8533 Mbps and an RGBW ISP. Moreover, the Dimensity 9200 relies on TSMC’s second-generation 4 nm manufacturing process (N4P), along with ARM’s second-generation Armv9 architecture. For reference, MediaTek has built the Dimensity 9200 with the following CPU cores:
- 1x Cortex-X3 – 3.05 GHz
- 3x Cortex-A715 – 2.85 GHz
- 4x Cortex-A510 – 1.8 GHz
Purportedly, MediaTek’s new chipset delivers 12% better single-core performance in Geekbench 5.0 than the Dimensity 9000. However, the gap narrows to 10% in multi-core work. With that being said, the Dimensity 9200 offers 25% lower power consumption under load, 10% better heat dissipation capabilities and up to 32% improved GPU performance in Manhattan 3.0 when compared to the Dimensity 9000 while utilising 41% less power to boot.
All in all, MediaTek boasts that the Dimensity 9200 scores 1,260,000 points in AnTuTu v9, which would be significantly higher than any current flagship scores. Currently, MediaTek has only revealed that the Dimensity 9200 should reach shelves ‘by the end of 2022’. Unfortunately, it remains to be seen in what smartphones the Dimensity 9200 will feature, nor how it compares to the upcoming Snapdragon 8 Gen 2.
Alex Alderson – Senior Tech Writer – 6839 articles published on Notebookcheck since 2018
Prior to writing and translating for Notebookcheck, I worked for various companies including Apple and Neowin. I have a BA in International History and Politics from the University of Leeds, which I have since converted to a Law Degree. Happy to chat on Twitter or Notebookchat.
Alex Alderson, 2022-11- 8 (Update: 2022-11- 8)
